NeMoH – Microelectronics for AI – Neuromorphic Hardware

In the project “Microelectronics for AI – Neuromorphic Hardware”, supported by the state of Baden-Württemberg, three industry-related research institutes of the Baden-Württemberg Innovation Alliance are researching and developing adaptive, safe and energy-efficient AI chips. These are considered as an elementary prerequisite for applications in the field of Industrie 4.0 and the Internet of Things (IoT). The project is coordinated by the Institut für Mikroelektronik Stuttgart (IMS CHIPS). Together with the Forschungszentrum Informatik (FZI), and the Hahn-Schickard-Gesellschaft für angewandte Forschung e. V. accompanied by an industry advisory board the project has started in mid-2019.
The institute contributes its expertise in the design of complex integrated circuits, measurement technology and the assembly of intelligent microsystems. Within the project IMS CHIPS will develop ASICs which can sense and preprocess analog input signals and further process them based on an evaluation platform with a neuromorphic approach.

Project duration: June 25th, 2019 thru December 31st, 2020
Funded by the Baden-Württemberg govt. (MFW)
Support code: AZ 3-4332.62-IMS/53

For further information the “Mikroelektronik für KI – Neuromorphe Hardware” research project, please refer to: NeMoH

MULTI-3D – focus-modulating 3D sensor system

As part of the sponsoring program “Photonik Forschung Deutschland” the research project MULTI-3D will be developing a micro-optical 3D sensor system to determine and/or measure 3D objects.

The “High-dynamic linear CMOS image sensor” project part will have Institut für Mikroelektronik Stuttgart developing an image sensor that is able to acquire a very high dynamic range. Just like many other image acquisition processes the anticipated micro-optical 3D sensor system will be able to record a very high luminance range of the detected objects as well as an interfering light of the surrounding conditions.
Project partners are SICK AG, GBS GmbH, Fraunhofer IOF and Friedrich-Schiller Universität Jena.

Project duration: February 1st, 2017 thru December 31st, 2020
Funded by BMBF
Support code: 13N14227

Fiber Coupling – Photonic interconnection technology with optimized coupling efficiency

The signal technical connection of photonic components is made using optical fibers, which couple light into the chips via microscopic structures (grid couplers). The efficiency of this fiber coupling is decisive for the overall properties of the circuit. Currently there is a conflict of objectives between the necessary coupling efficiency and throughput capability of the relevant procedures (glass fibers need to be precisely aligned and attached in six axes). The project´s objective is to develop new grid couplers with a particularly high degree of couple efficiency which simultaneously meet future cost requirements using processes and procedures suitable for mass production. The main idea is to create guide structures in the form of buried structures in the wafer using special laser-assisted etching processes, into which the fibers are inserted.

IMS CHIPS will be developing an etching process which removes the laser-treated structures in silicon with higher selectivity than the untreated structures. The developmental work within the scope of the project include individual processing steps in a known production process.

Project duration: November 1st, 2018 thru October 31st, 2020
Funded by ZIM/AIF
Support code: ZF4429203DF8

HDRC-AeroPantoCam

The 2-year ZIM project was launched in July 2018. Project partners are KST GmbH – Kamera & System Technik and GEVITEC.
The project will see the development of a sensor system for visual and thermal monitoring of railed vehicle pantographs The HiDRaLoN sensor will be further advanced from the ColorEye project combined with an embedded system for the application in railway technology. This includes adequate and reliable data transmission between the outdoor sensor system and a computer-based real-time evaluation platform as well as a live display screen with a possible automatic alert function in the railed vehicles driver´s cab.

Project duration: July 1st, 2018 thru June 30th, 2020
Funded by AIF
Support code: ZF4429202GR8

FLEXMAX – flexible active sensor matrix for medical applications

The BMBF sponsored project “FLEXMAX” was launched April 1st, 2018.
Flexible sensor foils offer crucial respiratory monitoring signals of prematurely-born babies to doctors. The project´s focus is on the development of flexible sensor foils that adjust well to erratic or fluctuating surface forms. This will be verified in two different applications using medical demonstrators. Within the Bundesministerium für Bildung und Forschung “Smart Health” sponsoring program the project proposal has been designated high priority and 2.1 mio. euros have been made available for the research and development of the medical demonstrators.

IMS CHIPS is developing customized evaluation ICs to control and analyze the sensor signals as well as integrating its expertise in technologies to embed ultra-thin chips into the foil system.

Project duration: April 1st, 2018 thru June 31st, 2021
Funded by BMBF
Support code: 16ES0775

For further information on the FLEXMAX research project, please refer to: www.elektronikforschung.de/projekte/flexmax

BW-CPS – smart intelligent energy-efficient sensor systems

The new “BW-CPS” project (CPS = cyber-physical systems) is an initiative sponsored by the Baden-Württemberg government for the development of a modular system component kit for intelligent and energy-efficient sensor systems for Industrie 4.0. By showing 4 practical cases of application the potential of the system component kit for future production facilities is demonstrated. This is about monitoring energy flow, controlling air conditioning, collecting processing data in in-molds as well as optimizing intralogistics and navigational components. All of this is done in close cooperation with the industrial sector which benefits from all of the newly developed functions that are thus becoming available. Apart from IMS CHIPS the FZI and Hahn-Schickard are participating in the BW-CPS project.

Project duration: April 7th, 2017 thru February 29th, 2020
Funded by the Baden-Württemberg govt. (MFW)
Support code: 3-4332.62-HSG/77

BW-CPS Flyer

GaNScan – mapping and modeling of GaN/Si wafers for power electronic applications

As part of the KMU-innovativ project GaNScan transistors and testing structures made of the compound semicondutor gallium nitride (GaN) are to be produced and researched on silicon wafers with epitaxy layers. These structured are used for space-resolved measurement (mapping) of testing and component parameters. This is done to research new structures and increase the measurement and test engineering competences in order to extract key parameters. The extracted parameters will offer an inside into the quality and characteristics of the substrate and epitaxy. This crucial information is returned to the epitaxial distributor to improve the reliability and quality of the transistors. Project partners are RoodMicrotech (projekt management, KMU), AdMOS (KMU) and IMS CHIPS.

Project timetable: September 1st, 2017 thru February 29th, 2020
Funded by BMBF
Support code: 16ES0745

Project GaNScan

C-GaN – Complementary GaN Transistors for Logic Devices in High-temperature

The scope of the “C-GaN” project in cooperation with RWTH Aachen University (Compound Semiconductor Technology, Lehrstuhl für Höchstfrequenzelektronik) is to explore the technical and physical limits of complementary gallium nitride (GaN) transistors for logic devices in high-temperature (temperatures up to 1000 °C) and high-frequency applications.

High-temperature applications, such as aerospace components, automotive electronics and oil drilling equipment, exceed temperature limits know in conventional silicon technology. Logic devices based on GaN can be implemented in high-temperature and high-frequency applications due to the outstanding material properties of GaN. In order to reach this goal a heterogeneous academic consortium has formed bringing together leading scientific groups in the field of nitride materials and device technology, high-temperature characterization and packaging technology, and also, RF testing, modelling and circuit design.

Project timetable: May 1st, 2017 thru January 31st, 2020
Funded by DFG
Support code: AL 1989/2-1 (DFG)

Energy filter – Development of large-scale energy filter membrane for single wafer ion implant in silicon carbide

In a ZIM-promoted project the IMS and the new start-up mi2-factory are joining together for technological processes on the high-energy ion implantation of SiC power semiconductors. The focus, however, is on the Stuttgart-based development of large-scale and high-precision Si membrane masks, so-called energy filter membranes.
The energy-filtered single-wafer ion implantation process was developed at mi2 factory and successfully applied in the manufacture of SiC power components.
The developmental focus at IMS CHIPS will be on the following topics in the next few years: yield, no defects, original wafer and stress-optimized layout.

Project timetable: April 1st, 2017 thru March 29th, 2019
Funded by AIF Projekt GmbH
Support code: ZF4429201GM7

Project “Energy filter”

TAKEMI5 – technology Advances and Key Enablers for Module Integration for 5 nm

In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to discover, develop and demonstrate lithographic, metrology, process and integration technologies enabling module integration for the 5 nm node.
This is planned with available EUV/NA0.33 scanners that are optimized for mix and match with existing DUV/NA1.35 scanners, and with system design and development of a new hyper NA EUV lithography tool to enable more single exposure patterning at 5 nm to create complex integrated circuits.
Institut für Mikroelektronik Stuttgart (IMS) will be participating in the work packages lithography and mask infrastructure. The lithography work package plans the development of highly-precise diffractive optical elements (DOE) for the surface test of EUV mirrors while the IMS will be researching new concepts in mask architecture in the mask infrastructure work package.
The TAKEMI5 project relates to the ECSEL work program topic Process technologies – More Moore.
The ECSEL project will be accompanied by a simultaneously running BMBF project.

Project timetable:: April 1st, 2017 thru June 29th, 2019
Funded by EU
Support code: 737479

Project TAKEMI5

µHTS-CAN – micro High Troughput Screening Cell Adhesion Noise-(Spectroscopy)

The KMU-Innovativ project µHTS-CAN is to develop a CMOS microchip-based imaging system for a speedy analysis of biological cells. This project is part of the Biotechnologie-BioChance sponsorship activities.

This sub-project in which Institut für Mikroelektronik Stuttgart cooperates develops and tests processes to reliably create micro-structured surface structures from permanent photo resists (dry film resist) with integrated reference electrodes on Si chips.
It is the goal to create impermeable and bio-compatible compartments on CMOS analyzing chips for the incooperation of the cells. These structures are to be adjusted in form and size depending on the chip design and client requirement. Project partners are Venneos GmbH and Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

Project timetable: February 1st, 2017 thru July 31st, 2019
Funded by BMBF
Support code: 031B0285B

innBW implant – Chip-in-foil systems for bio-electronic medicine

Bio-electronic micro implants are increasingly receiving more attention in the medical field. The tiny midgets can stimulate the neural system and, thus, be effectively used in the treatment of pain, migraine and depression as well as diabetes or high blood pressure. As of now, however, this development is still in its early stages. The research partnership combining of four Innovationsallianz Baden-Württemberg (innBW) research facilities is going to change this now. This research project is known as “innBW implant” and was launched on July 1st, 2015. The Ministry for Finance and Economy in Baden-Württemberg will be funding it with 3.65 mio. Euros.

Project timetable: July 1st, 2015 thru December 31st, 2018
Funded by the Baden-Württemberg govt. (MFW)
Support code: 7-4332.62-NMI/49

Pressemitteilung innBW Innovationsallianz Baden-Württemberg

NEMEZU – new precious metal-free membrane electrode units for future fuel cells

The NEMEZU project will be researching and developing new precious metal-free membrane electrode units for alkaline fuel cells of the future.

With a laser ablation on specially-selected precious metal-free materials and alloys the mass-implemented and cost-effective manufacture of catalytic layers for the use of micro-fuel cells will be developed. The effectiveness of alkaline fuel cells will be determined and measured during operation using infrared thermography of electro-chemical reactions.
The Institut für Mikroelektronik Stuttgart will be developing and producing Si3N4 membrane systems on 150 mm wafer to evaluate precious metal-free catalytic systems during fuel cell operations.

Project timetable: December 1st, 2015 thru November 31st, 2018
Funded by BMBF
Support code: 03SF0497D

ParsiFAl 4.0 – Product-capable autonomous and safe foil systems for automation solutions in Industrie 4.0

IMS CHIPS has joint partners in the ParsiFAl 4.0 research project on the development of new sensors and electronics on thin foil.

The ParsiFAl 4.0 research project which is supported by the Bundesministerium für Bildung und Forschung comprises several partners supported by the project administrator VDI/VDE-IT on the development of thin electronics systems, i e. Smart Sensor System (S3) labels. The foundation for S3 labels is micro controllers, sensors, thin displays and integrated communication interfaces, all of which are embedded into foils. The ascertained data can determine a component´s condition and, therefore, maintain equipment pro-actively. This reduces maintenance fees on production equipment significantly. Thus, transportation of critical goods can be tracked safely in the logistic and packaging field.

Project timetable: November 1st, 2015 thru October 30th, 2018
Funded by VDI/VDE-IT
Support code: 16ES0435

Press release: ParsiFAl 4.0

SeNaTe – Seven Nanometer Technology

SeNaTe consists of 6 work packages focusing on lithography, metrology, processing, EUV mask infrastructure and a 7 nm process demonstration with one work package being reserved for project management.
Institut für Mikroelektronik Stuttgart (IMS) will be participating in the work packages lithography and mask infrastructure. The lithography work package plans the development of highly-precise diffractive optical elements (DOE) for the surface test of EUV mirrors while the IMS will be researching new concepts in mask architecture in the mask infrastructure work package.
The ECSEL project will be accompanied by a simultaneously running BMBF project.

Project timetable: April 1st, 2015 thru March 31st, 2018
Funded by EU
Support code: 662338

MEMS-DMFC – Direct methanol fuel cell based on micro electric mechanical systems

The ever increasing appetite for energy in portable electronics poses a particular challenge nowadays. Because of its enormous energy storage density a methanol-based fuel cell could just be the ideal solution opposed to traditional battery technologies.
The cell contains a proton-conductive silicon-based membrane whose characteristics are crucial for the fuel cell´s efficiency.
The MEMS – DMFC project´s goal is the development of MEMS cells based on a silicon semiconductor technology that will enable the production of cost-effective fuel cells for the down market.

This AIF (Allianz Industrieforschung) sponsored project is set to run for 2.5 years and will be a cooperation with Zentrum für BrennstoffzellenTechnik ZBT GmbH.

Project timetable: July 1st, 2015 thru December 31st, 2017
Funded by AIF
Support code: 18771 N

SITARA – Self-adapting intelligent multi aperture camera modules

The aim of the project is the development of cost-effective, intelligent and powerful cameras with a high-dynamic range as well as ashort face-to-face dimension of less than 3 mm. These outstanding properties are to be realized by developing synchronized high-dynamic range image sensors and special micro-optical systems.. Using micro and nano structuring technology, the optical components developed as demonstrators will be comparable to the naturally occurring compound eye.

Course of the project: May 1st, 2014 thru September 30th, 2017
Funded by BMBF
Support code: 13N12996

www.projekt-sitara.de

Color Eye – high-dynamic color image sensor with new color and corrective algorithms

The SME company hema electronic GmbH and IMS CHIPS are cooperating on the “ColorEye” project in developing particularly small new intelligent high-resolution video cameras based on the new HDRC® image sensor with Global Shutter technology. These cameras will be ideal for dynamic process control in sophisticated industrial applications, such as automation and assistance systems in hauling vehicles.
IMS CHIPS will be developing new color and corrective algorithms based on the new high-dynamic and high-resolution Global Shutter sensors, which were developed within the frame of the European sponsoring program CATRENE.
To improve the quality of packaged high-dynamic HDRC sensors IMS CHIPS is developing a miniature lighting test unit for optical and electric characterization under real operating conditions that can be integrated into an automatic component handler.

Project timetable: September 1st, 2015 thru August 31st, 2017
Funded by BMWI (ZIM)
Support code: 16KN037741

KATMETHAN – Catalytic methane synthesis

The target is to research new peptide-based catalysts for a methane synthesis as well as an increased and improved understanding of the complex conversion processes. The KATMETHAN project has an overall volume of 1.462 million € and is sponsored by the BMBF using 995,000 € in funds from the energy and climate fonds. IMS CHIPS is sponsored with 203,000 €. The project´s duration is three years. The project management agency is Projektträger Jülich, Geschäftsbereich Energietechnologie, Fachbereich Grundlagenforschung Energie (support code: 03EK3030D).

Project timetable: September 1st, 2014 thru August 31st, 2017
Funded by BMBF
Support code: 03EK3030D

Smart-LiB – Intelligent Li ion batteries in production and use

The Smart-LiB project, a joint project between IMS CHIPS and the Innovationsallianz Baden-Württemberg (innbw) partner ZSW, was launched on October 1st, 2015, and is set to last until September 30th, 2016. This project is designed to research solutions to encompass the Li ion battery staple´s condition without the currently required wiring (SoH – State of Health, SoC – State of Charge).
The decentralized or mobile storage of electrical energy using batteries is a key technology for the 21st century energy supply. Lithium ion cells are core elements in modern hybrid and electric power since they are crucial to costs, operating distance and reliability of a vehicle. This makes the lithium ion technology a strategic element for the automobile industry in the future.

Project timetable: October 1st, 2015 thru March 31st, 2017
Funded by the Baden-Württemberg govt. (MFW)
Support code: 7-4332.62-ZSW/45

TENECOR – Telemetric multimodal neonatal cortexmonitoring

The aim of this sub-project is the micro-electronic integration of a subsystem for safe automatic detection of EEG signals in preterm infants using a “electrode Cap”. The subsystem can be achieved as ASIC in addition to other components for the safe operation, error detection and data and status transmission to parent system parts of signal amplification, conditioning, and digitalisation. The subproject is an integral part of the demonstrator in the joint project designed with its fully integrated EEG – and impedance measuring circuit.

Project timetable: March 1st, 2014 thru February 28tht, 2017
Funded by BMBF
Support code: 13GW0033E

Projektbeschreibung.

KoSiF – Complex systems in foil

The KoSiF (Komplexe Systeme in Folie) research project researchs, evaluates and technologically adjusts the necessary technologies for additional functionalities that will be required for the manufacture of future thin and flexible products. KoSiF represents an initiative made up of industry, research facilities and universities aiming to find means of integration of thin silicon chips, thin-film components and organic electronics on one foil substrate enabling autonomous and intelligent flexible electronics.

The project will realize two demonstrator, i. e. Smart Skin and Smart Switch, which will be connected to similar key technologies.

Project timetable: January 1st, 2013 thru June 30th, 2016
Funded by BMBF
Support code: 16ES00012

KoSiF Project-Webseite.

X-MIND – Analyses on extremely miniaturizid optical speedsensor

The X-MIND project will see the development of an optical low-cost speed sensor. It will be designed as an absolutely coded speed sensor with the potential for the highest degree of miniaturization. Furthermore, this design will benefit from a very simple mounting technique. The speed sensor is, for example, completely insensitive to an eccentricity of a sensor wave. This advantage and its compilation of few, cost-effective, optical components offers the potential for a low-cost speed sensor that will be able to explore new applications, such as in medical technology or the consumer sector.

Project timetable: January 1st, 2014 thru April 30th, 2016
Funded by AIF
Support code: 17898 N

The ETIK joint project advances EUV lithography

The focus is on EUV lithography which uses extreme ultraviolet (EUV) light to structure microchips. This new type of technology will reach production level by the end of this year and confer structures by 20 nano meters. ETIK (“EUV projection optics for 14 nm solution”) will even take it one key step further. It aims at improving the solution reached by using EUV lithography by at least 14 nano meters.
IMS CHIPS assures the quality of projection objective by making optical power components available.

Project timetable: June 1st, 2012 thru December 31st, 2015
Funded by BMBF
Support code: 16N12257

press releases

PEPDIODE – Peptide based diodes for solar cells

In this EU-project, 6 partners from 4 different countries work together on a revolutionary peptide-based diode screening, enabling the evolutionary development of novel solar-cells.

Project timetable: August 1st, 2011 thru July 31st, 2015
Funded by EU
Support code: 256672

PEPDIODE Project-Webseite

INSERO3D – Intelligent Service Robotics by means of 3D image capture and processing

In INSERO3D the conclusions from the PRONTO project KonKaMis regarding the integration of the plastics, silicon and sensor technology as well as the required packaging techniques for the design and manufacture of digital sub-miniature cameras will be sized and advanced. The project´s goal is to create technological solutions for the intelligent optical positioning of service robots in a predefined area and/or create interaction therewith..

Project timetable: October 1st, 2012 thru June 30th, 2015
Funded by BMBF
Support code: 16SV5998

For further information, please go to INSERO3D Projekt-Webseite.

ITAS – Integration Technology for Autonomous Sensor Systems

Autonomous sensor modules will be at the forefront of market development if energy-efficient and compact solutions can be realized.
The ITAS project is developing a technology platform for integrative technologies of autonomous sensor modules focusing on miniaturization, energy and data efficiency while applying wireless communication interfaces and energy harvesting.

Project timetable: October 1st, 2012 thru June 30th, 2015
Funded by BMBF
Support code: 16SV5970K

For further information, please go to the ITAS Projekt-Webseite.

SMART IMPLANT: Implantable electronics for diagnostic and therapeutic purposes

MST solutions for integrative sensors, actors as well as electronic building groups for energy and data management in complex active medical micro implants for diagnostic, therapeutic and rehabilitation purposes.

Project timetable: October 1st, 2012 thru June 30th, 2015
Funded by BMBF
Support code: 16SV5986

FlexPacFAM – Flexible packaging of micro-system technical components based on Printed Circuit Boards by means of film assisted molding

The recently finalized FlexPacFAM project researched alternative circuit board-based packaging solutions and developed, among else, a QFN housing-compatible package that can also be produced in small series.

Project timetable: December 1st, 2012 thru January 31st, 2015
Funded by BMBF/AIF
Support code: 17602 N

For more information about FlexPacFAM, see the PDF.

PRONTO – Production Platform for Microsystems

The PRONTO platform acts as instrument for the industrial sector to test, introduce and support a variety of non-sector specific micro system technology applications while establishing serial production.

Project timetable: July 1st, 2010 thru December 31st, 2014
Funded by MWK Ministerium für Wissenschaft und Kunst
Support code: 1499 / 685 37

PRONTO Project-Webseite

OASIS – Online Failure Prediction for Microelectronic Circuits Using Aging Signatures

Microelectronic circuits suffer from life-time limiting aging. In this project, online in-field methods to assess circuit performance and remaining life-time will be developed to predict failures due to aging processes.

Project timetable: August 8th, 2011 thru December 31st, 2014
Funded by DFG
Support code: WU 245/11-1

OASIS Project-Webseite

RTFIR – IR sensitve image sensors successfully tested

Process engineering fundamentals for the design of IR optics by precision hot forming processes; sub-project: Development and design of an FIR-sensitive camera pixel field and adequate evaluation circuit.

Project timetable: October 1st, 2010 thru June 30th, 2014
Funded by BMBF
Support code: 16SV5131

ModFlex – modular current measuring system for the measurement on nonplanar surfaces as well as in non-accessible measurement environments

The ModFlex project will see the development of a very thin mechanically flexible thermo-electric micro system current sensor with the relevant thin and flexible electronics and telemetric energy and data transmission.

Project timetable: November 2011 thru February 2014
Funded by ZUTECH / BMWi
Support code: 17192N/2

HiDRaLoN – High Dynamic Range Low Noise CMOS Imagers

In order to research concepts for a new generation of image sensors with high dynamic range and high resolution combined with low noise using alternative CMOS technology, a strong German project network has been formed within the European CATRENE research project HiDRaLoN (High Dynamic Range Low Noise CMOS Imagers). After approx. 3 years the research work will be successfully completed.

Project timetable: May 1st,.2009 thru June 30th,.2012
Funded by EU
Support code: 13N10370

EXEPT – Extreme UV Lithography Entry Point Technology Development

The joint project “Lithography for the 22-nanometer node” has been successfully completed. In this national project embedded in the European EXEPT project (“Extreme UV Lithography Entry Point Technology Development”) led by the Dutch company ASML as part of the CATRENE cluster – eight German companies and research institutions have further developed EUV lithography from basic research to a fully applicable technology for the series production of microchips at the 22-nanometer node.

Project timetable: May 1st,.2009 thru May 31th,.2012
Funded by BMBF

HyperBraille – a graphics display for the vision impaired

In the Hyperbraille project, a touch-sensitive surface display was developed. Based on the successful project results, the implementation of the surface display in a product ready for series production was announced for the end of 2011.

Project timetable: 2007 thru October 31st,.2010
Funded by BMWi

HyperBraille project-webseite

Project Chipfilm

The Chipfilm™ project, carried out with funding from the Landesstiftung Baden-Württemberg foundation on behalf of the Ministry of Economics, was successfully completed in November 2009. Scientists at the Institute of Physical Electronics at the University of Stuttgart (ipe) and at the IMS, with the support of four companies, investigated fundamental properties of ultra-thin silicon chips produced using the new Chipfilm™ technology.

Project timetable: June 1st,.2007 thru November 30th,.2009
Funded by the Baden-Württemberg govt. (MFW)