M(E)MS technologies
In M(E)MS Technologies, we focus on large-area micro-(electro-)mechanical systems (M(E)MS) and silicon photonics. Within these two focus areas, we develop and manufacture micro mechanical components made of silicon, electron-optical micro systems for beam deflection and active/passive photonic components made of silicon and Si3N4. By combining M(E)MS, CMOS and nanostructuring processes, novel prototypes and systems of highest precision can be realized quickly and cost-effectively.
• M(E)MS
• Si photonics
M(EM)S
Membranes
We manufacture membranes in various forms and sizes made from various materials. Structuring is possible directly in the membrane (“Stencil mask”) or in the case of Si3N4 membranes in a thin Cr absorber layer (“absorber mask”).
Contact
Florian Letzkus
email: Florian Letzkus
We are looking forward to assisting you with your development and research projects.
Micro mechanic components
The silicon deep etching technology we use allows us to manufacture versatile micro mechanical components. This way structures as small as 50 nm with an aspect ratio (ratio of width to depth) of 1:50 can be realized. An etching through the entire substrate is also possible. Furthermore, a structuring of the silicon on several levels with a clamping surface accuracy of ± 25 nm is feasible.
Micro-Electro-Mechanical Systems
Special technologies developed by us are used to subsequently process finished CMOS chips. These include: deep silicon etching, the selective thinning of components areas to membranes or layer thining and structuring. These steps can be carried out on foundry as well as our own CMOS wafers. In addition, CMOS circuits and micro-mechanic components can be arranged facing each other and equipped with electrical interfaces.
