IMS CHIPS as alliance partner for the production of next generation integrated circuits

The ECSEL joint project ID2PPAC, funded by the European Union and the German Federal Ministry of Education and Research (BMBF) with nearly 48 million euros, will consolidate and integrate the technology solutions for the 2-nm node identified in previous work. The goal is to demonstrate that the Performance Power Area and Cost (PPAC) requirements for this new generation of leading logic technology are within reach.

To continue the so-called Moore‘s Law for the 2-nm node while meeting the PPAC requirements, a combination of further advances in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project is based on a common pilot line and the focused commitment of the partners involved, who have exceptional expertise in key interrelated areas.

The ID2PPAC project is expected to enable IC-Fabs to perform so-called EUV-based single-print high-volume manufacturing for the 2-nm node by 2025.

To meet the ever-increasing demand for more computing power, the semiconductor industry is continuously working on technological innovations to realize this progress as predicted by Moore‘s Law and will continue to do so.

The project will also help build Europe‘s technological capability in this area, which is critical for digitization, (edge) AI and to solve national, European and global societal challenges, as well as strengthen the consortium of leading European companies and research facilities active in this field.

Institut für Mikroelektronik Stuttgart (IMS CHIPS) will participate in the Lithography Equipment work package. A part of this work package is the development of high-precision diffractive optical elements (DOE) for surface inspection of EUV mirrors.