Newsletter 1-2022 - Institut für Mikroelektronik Stuttgart

IMS CHIPS Newsletter 1/2022

The topics of the current issue are:

Nano-HySiF – Nano contacts for flexible electronics

Nano contacts are used to apply ultra-thin chips to flexible films like Velcro. In cooperation with our partner NanoWired, the technology is being researched and tested for applications in flexible electronic systems for medical technology.

PanaMEA – ASIC for a Miniature Pancreatic Implant

In the BMBF-funded PanaMEA project, an ASIC for a miniature pancreatic implant is developed at IMS CHIPS. A unique feature of the design is an integrated solution for FOPP (Fraction of Plateau Phase) detection of the beta-cell activity. Smart approach is adopted to keep the design overhead to a minimum, resulting in a low-power system with highly reduced data volume, which can be applied to more advanced beta-cell activity monitoring.

IMS CHIPS as alliance partner for the production of next generation integrated circuits

In order to meet the growing demand for more computing power, especially in networked devices, the technologies to manufacture high-performance chips in the 2-nm process must be developed today. The prerequisites for mass production should be in place by 2025. IMS CHIPS supports the work to establish the 2-nm node within the ECSEL project ID2PPAC.

PhotonQ – Measurementbased and scalable quantum processor

In the PhotonQ project, funded by the BMBF, a measurement-based and scalable processor for a photonic quantum computer will be developed with our university partners. At the heart of the quantum processor is an integrated photonic chip, which is being researched and developed at the IMS. For this purpose, new types of phase shifters, integrated optical circuits and optical interconnect technology will be investigated.

News Flash

Best Paper Award –- For the paper: "Front-End Electronics for Beta-Cell Function Monitoring with an Integrated FOPP Detector", Dr. Zili Yu and co-authors received the First Place Best Paper Award at IEEE SENSORS.

Joint project SensIC – In this joint project, BMBF is funding the development of reliable electronic components that are integrated directly into machine components and determine safety-relevant sensor data there. IMS CHIPS supports KIT in a development contract with hybrid foil systems and integration technologies. For further information, please visit https://www.nanomat.de/sensIC.php.

Nanopatterning Cluster+ – Nanopatterning Cluster+ – IMS CHIPS receives a grant of 6.4 million euro for the project Nanopatterning Cluster+ and 1.98 million euro for the project Nanopatterning Cluster+ Phase 2 from the Ministerium für Wirtschaft, Arbeit und Tourismus Baden-Württemberg within the framework of the European Regional Development Fund (ERDF) and the REACT-EU development aid. Within the scope of this project, an infrastructure for the large-area and flexible fabrication and characterization of a wide variety of nano structures in and on different substrates and materials is to be created in the clean rooms.

Our current newsletter is also available as a PDF-document.