Microelectronic Technology Seminar

The course provides in-depth knowledge of the fundamentals of manufacturing modern microchips from silicon wafers to mask processes, circuit development, chip assembly technology and test methods. The components and the associated process steps are presented in detail and in a practical manner.

Requirements: Knowledge in electrical engineering, basic knowledge in production engineering

Participant group: Electronics developers, project managers, service, development engineers in the semiconductor manufacturing devices/materials field.

Contents:
1. Microelectronics change the world
(J. Burghartz)
2. From system to silicon structure
(C. Burwick)
3. Lithography
(H. Sailer)
4. Wafer processing
(M. Zimmermann)/(B. Leibold)

Guided tour of the Technology building

5. CMOS overall process
(M. Zimmermann)
6. Packaging and interconnection technology
(A. Berndt)
7. Test of microelectronic circuits
(C. Burwick)
8. Quality assurance and Reliability
(W. Klingler)

Director:
Prof. Dr.-Ing. J. Burghartz / Institut für Mikroelektronik Stuttgart

Speakers:
Dipl.-Ing. Armin Berndt
Prof. Dr.-Ing. Joachim Burghartz
Dr. Christian Burwick
Dipl.-Ing. Wolfram Klingler
Dipl.-Ing. Bernd Leibold
Dr. Holger Sailer
Dr. Martin Zimmermann