IMS Newsletter 1/21

The topics of the current issue are:

Deutscher Zukunftspreis 2020
The project “EUV lithography – new light for the digital age” is awarded Deutscher Zukunftspreis 2020. A key element for the production of the EUV optics are highly accurate “Computer Generated Holograms”, which are developed and produced in a unique technology at Institut für Mikroelektronik Stuttgart.

Microelectronics in AI – neuromorphic hardware
In this joint project funded by the state of Baden-Württemberg, the requirements for adaptive as well as secure and energy-efficient AI chips are being developed. These are now considered central building blocks for an increasing amount of applications in the Industry 4.0 and Internet of Things field.

MOCVD 4.2 – Metal Organic Chemical Vapour Deposition technology
The MOCVD 4.2 project is a joint publicly-funded project to increase the production capability of the MOCVD (Metal Organic Chemical Vapour Deposition) technology for applications in power electronics, in photo voltaic as well as in nano photonics and sensor technology. As part of the project GaN-on-Si, wafers provided by the project partners will be characterized at IMS CHIPS.

MULTI-3D – focus modulating multimodal 3D sensor system
IMS CHIPS has worked on the investigation of a CMOS image sensor, which can illustrate a very large dynamic range with a linear characteristic and a large signal-to-noise ratio within the “MULTI-3D” project. The project consortium included IMS CHIPS, two industrial partners, Fraunhofer IOF as well as Friedrich Schiller University Jena.