Nano-HySiF-Project

January will see the launch of a cooperation with the Hessen-based Nano Wired GmbH, a company sponsored the Central Innovation Program for SMEs of the BMWI (ZIM). The project entails technologies developed by NanoWired to contact chips with nano structures, which can be electrically connected similar to Velcro, combined with the Chip-Film Patch (CFP) technology from IMS CHIPS. The result will be hybrid systems in films (HySiF), i. e. bendable films with integrated sensors and evaluation chips, which are particularly interesting for applications in medical technology. The new contacting technology will achieve considerable process simplifications and, thus, a reduction in costs and an increase in reliability.