IMS Newsletter 1/24

The topics of the current issue are:

Successful energy conservation at Institut für Mikroelektronik Stuttgart
Institut für Mikroelektronik Stuttgart has made significant progress in saving energy. Through a series of measures, the annual demand for electricity, district heating and district cooling has been massively reduced.
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Further development of patented GaN nanohole technology in the ALL2GaN project

The GaN nanohole technology patented by the IMS for the production of normally-off GaN high electron mobility transistors (HEMTs) with positive turn-on voltage is being further developed in the ALL2GaN project. For this purpose, monolithic integrated circuits are produced using application demonstrators, which enable the simultaneous production of power, high-frequency and MEMS components on one wafer in a common GaN technology.
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HyPerStripes – New packaging and connection technology for reliable bendable electronics

The second kick-off meeting that took place at IMS CHIPS in April marks the start of the European joint project HyPerStripes – “New packaging technology for reliable bendable electronics” entering its final year. 16 partners from three countries are collaborating to develop solutions for flexible connections and two-dimensional hybrid film systems.
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PhotonQ project

In the PhotonQ project, funded by the BMBF, a measurement-based and scalable processor for a photonic quantum computer will be developed with our university partners. At the heart of the quantum processor is an integrated photonic chip, which is being researched and developed at the IMS. For this purpose, new types of phase shifters, integrated optical circuits and optical interconnect technology will be investigated.
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