HyPerStripes project

All 16 partners of the European collaborative project HyPerStripes (New packaging technology for reliable bendable electronics) met in March at the Holst Center on the High Tech Campus in Eindhoven for the first project review. The European reviewers and the representatives of the national funding agencies were impressed by the project progress and the good cooperation in the consortium, which is jointly developing and comparing technologies for smart, flexible and large-area electronic systems for six application demonstrators. In addition to technological aspects, the project is also evaluating the sustainability of the new manufacturing processes.