IMS CHIPS Newsletter 2/2022

The topics of the current issue are:

DoRiE – AI for sensor-related applications in industrial use
Companies from Baden-Württemberg as well as the IMS CHIPS, FZI and Hahn- Schickard research facilities are jointly developing reference applications that demonstrate the sensor-related use of artificial intelligence. The Ministry of Economics in Baden-Württemberg is supporting DoRiE with 2 million euros.
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QSens: An outlook on the 3 joint projects in the Future Cluster
Within the framework of the “Future Cluster Qsens”, IMS CHIPS is involved in the QVOL, QSCALE and QIND projects. These projects will be carrying out application- driven work on the market introduction of quantum sensor technology in the areas of (bio)medical technology, industrial sensor technology and sensors for research as well as demonstrate scalable manufacturing possibilities.
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New i-Line Stepper Canon FPA3030i5a operational
With the commissioning of the new i-Line Stepper Canon FPA3030i5a for optical lithography, a further milestone in the expansion of the IMS line for 200 mm wafers was reached in June. This means that a state-of-the-art production facility is now available, which opens up numerous new opportunities for the IMS to develop new processes for the future.
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Qoool Camp 22 – The startup generator for quantum computing and quantum sensor technology
The “Future Cluster Qsens” and the first quantum computer in Europe offer outstanding opportunities for research and infrastructures. The question arises as to how these can be transferred into concrete applications and business models? The answer to this was addressed at Qoool Camp ‘22 and the following camp week at the AI xpress incubator in Böblingen.
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News Flash

„Beams & More“ This title defines the 19th lithography workshop to be held at the IMS. The workshop will take place as webinar on November 17th, 2022. For further information and registration, please go to beams-and-more.ims-chips.de

Projekt HyPerStripes launched The kick-off meeting in April marked the start of the European joint project HyPerStripes – “New packaging technology for reliable bendable electronics” in the European Penta program. 18 partners from four European countries will cooperate on the development of solutions for flexible interconnects and planar hybrid foil systems in the project initiated by the IMS. Additional information on the HyPerStripes project can be found at hyperstripes.ims-chips.de.

Springer Theses Prize – The „Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil“ dissertation written at the IMS by Dr. Mourad Elsobky has been awarded the Springer Theses Prize. For further information on the dissertation, please go to link.springer.com.

Our current newsletter is also available as a PDF-document.